Surface packing method for electronic component

Abstract

PURPOSE:To improve a circuit board in packaging density by a method wherein two or more lead wires are bent to form linear parts parallel to the circuit board, and a different electric component is arranged in a packaging space formed between a component main body and its lead wires. CONSTITUTION:Lead wires 12 of an electrolytic condenser 11 provided with lead wires are bent in a direction at a right angle with a lead out direction of the lead wires from a condenser main body 11a to form linear parts parallel to the surface of a board 15 so as to be surface-mounted on the board 15 keeping a specified space between the lead wires 12 and the condenser main body 11a. A soldering conductor pattern 14 of a second component 13 is provided to a position where the tip linear part of the lead wire 12 is mounted as a first component, paste solder is previously applied onto the electrode of the conductor pattern 14, and the leadless second component 13 is mounted thereon. Then, the first component 11 is surface-mounted and connected to the board 15. By this setup, the first component 11 and the second component 13 are packaged crossing each other on a circuit pattern, so that a circuit board can be improved in packaging density.

Claims

Description

Topics

Download Full PDF Version (Non-Commercial Use)

Patent Citations (0)

    Publication numberPublication dateAssigneeTitle

NO-Patent Citations (0)

    Title

Cited By (4)

    Publication numberPublication dateAssigneeTitle
    JP-2009527115-AJuly 23, 2009ヴァレオ システム ドゥ コントロール モトゥールコンポーネントを順序付けて固定することによる電子モジュールの生産方法
    JP-H0529748-AFebruary 05, 1993Canon Inc, キヤノン株式会社High density mounting method for printed wiring board
    KR-100718324-B1May 17, 2007(주) 에프원미디어, 권준모블루투스 모듈 인쇄회로기판
    WO-9948345-A1September 23, 1999Patent-Treuhand-Gesellschaft für elektrische Glühlampen mbHAnordnung elektrischer bauelemente auf einer schaltungsplatine