Fused spherical silica and sealing resin composition using the same


PURPOSE: To improve suppressing effects on fluidity and flash by containing specific fused spherical silica in the sealing resin composition. CONSTITUTION: Silica, having ≤5ppm electrically conductive impurity content, ≤1ppb α-radioactive impurity content, 10-30μm average particle diameter and containing 8-30wt.% fine part having ≤3μm particle diameter, 5-30wt.% part of coarse particle diameter having ≤48μm particle diameter and 0.65-1.10 tilting angle in a Rosin-Rammler chart in a particle size distribution of 8μm and 64μm particle diameter is fused and sphered to afford a silica filler consisting of fused spherical silica. The resultant silica filler in an amount of 60-85wt.% is then blended with a resin (e.g. epoxy resin), a curing agent (e.g. phenolic resin), a curing accelerator (e.g. BF), etc., to afford a sealing resin composition. COPYRIGHT: (C)1990,JPO&Japio




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Cited By (8)

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    EP-0607949-A1July 27, 1994Sumitomo Electric Industries, Ltd.Méthode et composition de résine pour mouler un bout de connecteur optique
    EP-0673957-A2September 27, 1995Mitsubishi Denki Kabushiki KaishaEpoxidharzformasse
    EP-0673957-A3December 27, 1995Mitsubishi Electric CorpMasse à mouler de résine époxyde.
    JP-2003048957-AFebruary 21, 2003Sumitomo Bakelite Co Ltd, 住友ベークライト株式会社Epoxy resin composition
    JP-2006143784-AJune 08, 2006Sumitomo Bakelite Co Ltd, 住友ベークライト株式会社エポキシ樹脂組成物及び半導体装置
    JP-4710195-B2June 29, 2011住友ベークライト株式会社エポキシ樹脂組成物
    JP-H02247236-AOctober 03, 1990Nippon Chem Ind Co LtdFused fine spherical silica and sealing resin composition containing the same
    US-5880179-AMarch 09, 1999Mitsubishi Denki Kabushiki KaishaMolded products for high voltage apparatus comprising brominated epoxy resins