Bonding of ceramics

Abstract

PURPOSE: To quickly bond ceramic parts at a high strength by diffusing and bonding an alumina-containing composite ceramic under specific temperature, pressing stress, straining rate and crystal size. CONSTITUTION: An alumina-containing composite ceramic is bonded by diffusing at 1000-1600°C, a pressing stress of ≤15kg/mm 2 , a straining rate of ≤10 -3 /sec and an alumina crystal size of ≤3μm. The bonding technique is applicable to the bonding of alumina/zirconia composite ceramics with each other, the above ceramics wherein one or both components are high-strength composite ceramics, alumina and alumina/zirconia composite ceramic, zirconia and alumina/zirconia composite ceramic, alumina and a composite ceramic containing whisker or fiber, etc. COPYRIGHT: (C)1990,JPO&Japio

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Cited By (6)

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    DE-4412525-B4May 25, 2005Denso Corp., KariyaSauerstoffsensor
    DE-4447998-B4December 22, 2005Denso Corp., KariyaSauerstoffsensor
    JP-4601136-B2December 22, 2010京セラ株式会社耐食性部材
    US-5447618-ASeptember 05, 1995Nippondenso Co., Ltd.Oxygen sensor
    US-5660661-AAugust 26, 1997Nippondenso Co., Ltd.Oxygen sensor
    WO-2009010427-A1January 22, 2009Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V.Composant céramique assemblé par diffusion et procédé de production de ce composant